Customized module lid
US9496194B2 · kind B2 · utility
6Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2014 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Feb 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.