Semiconductor package including an antenna formed in a groove within a sealing element
US9496219B2 · kind B2 · utility
6Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2013 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Jul 3, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.