Recessed metal liner contact with copper fill
US9496225B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2016 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Feb 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a contact above a source or drain region of an integrated circuit includes depositing a first liner conformally in a bottom and along a sidewall of a trench formed above the source or drain region, depositing a second liner conformally over the first liner, and stripping the first liner and the second liner from a portion of the sidewall from an opening of the trench to a height above the bottom of the trench. The method also includes depositing a third liner conformally over the second liner on the bottom and to the height above the bottom of the trench and on the portion of the sidewall, and depositing a metal fill to fill the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.