Inventor · Albany, NY, US

Praneet Adusumilli

151Patents
8h-index
67Co-inventors
79Inventor score

Filing activity: Jan 20, 2010 → Jun 22, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US9496225B1 Recessed metal liner contact with copper fill Electricity 384 Active
US9805989B1 Sacrificial cap for forming semiconductor contact Electricity 22 Active
US9741812B1 Dual metal interconnect structure Electricity 22 Active
US9768077B1 Low resistance dual liner contacts for Fin Field-Effect Transistors (FinFETs) Electricity 16 Active
US9437714B1 Selective gate contact fill metallization Electricity 14 Active
US10580966B1 Faceted sidewall magnetic tunnel junction structure Physics 13 Active
US10074727B2 Low resistivity wrap-around contacts Electricity 13 Active
US9935051B2 Multi-level metallization interconnect structure Electricity 9 Active
US9934977B1 Salicide bottom contacts Electricity 7 Active
US9978750B1 Low resistance source/drain contacts for complementary metal oxide semiconductor (CMOS) devices Electricity 7 Active
US9722038B2 Metal cap protection layer for gate and contact metallization Electricity 6 Active
US9735165B1 Vertically stacked FinFET fuse Electricity 6 Active
US10049980B1 Low resistance seed enhancement spacers for voidless interconnect structures Electricity 6 Active
US9805973B2 Dual silicide liner flow for enabling low contact resistance Electricity 5 Active
US9613899B1 Epitaxial semiconductor fuse for FinFET structure Electricity 4 Active
US10388600B2 Binary metallization structure for nanoscale dual damascene interconnects Electricity 4 Active
US10090287B1 Deep high capacity capacitor for bulk substrates Electricity 4 Active
US10056391B2 Vertically stacked FinFET fuse Electricity 4 Active
US10269698B1 Binary metallization structure for nanoscale dual damascene interconnects Electricity 4 Active
US9859403B1 Multiple step thin film deposition method for high conformality Electricity 4 Active
US9831254B1 Multiple breakdown point low resistance anti-fuse structure Electricity 4 Active
US9570574B1 Recessed metal liner contact with copper fill Electricity 4 Active
US10340355B2 Method of forming a dual metal interconnect structure Electricity 3 Active
US9564310B1 Metal-insulator-metal capacitor fabrication with unitary sputtering process Electricity 3 Active
US10915811B1 Intercalation cells for multi-task learning Physics 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.