Patent · US Active

Semiconductor device having solderable and bondable electrical contact pads

US9496237B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gottfried Beer · Nittendorf, DE
Raimund Foerg · Straubing, DE
Juergen Hoegerl · Regensburg, DE

Key dates

Filing date	May 19, 2015
Grant date	Nov 15, 2016
Priority date	—
Expiry date	May 19, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13055
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a semiconductor chip and a plurality of electrical contact pads disposed on a main face of the semiconductor chip, wherein the electrical contact pads each include a layer stack, each layer stack having one and the same order of layers, and wherein the electrical contact pads are both solderable and bondable.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.