Patent · US Active

Signal distribution in integrated circuit using optical through silicon via

US9496447B2 · kind B2 · utility

4Cited by

5References

11Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Effendi Leobandung · Stormville, US
James D. Warnock · Somers, US
Dieter Wendel · Schenefeld, DE

Key dates

Filing date	Jul 2, 2015
Grant date	Nov 15, 2016
Priority date	—
Expiry date	Jul 2, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E10/50
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An optical through silicon via is formed in a silicon substrate of an integrated circuit. A photo detector is formed within the integrated circuit and is optically coupled to a first side of the optical through silicon via. A light generating source optically coupled to a second side of the optical through silicon via is provided. The photo detector is configured to receive a light, generated by the light generating source, propagating through the optical through silicon via. The light, generated by the light generating source, is controlled by a signal generated by a signal generating source.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.