Heat dissipation for substrate assemblies
US9497889B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2014 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Aug 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic system includes a substrate, at least one electronic component, and a heat sink. The at least one electronic component is mechanically coupled to the substrate and thermally coupled to a ground plane of the substrate, such that heat generated by the at least one electronic component is dissipated at least partially to the ground plane of the substrate. The heat sink is mechanically coupled to an edge of the substrate, and thermally coupled to the ground plane of the substrate to at least partially dissipate the heat generated by the at least one electronic component. In some embodiments, the heat sink further includes an attachment structure, a tab and a plurality of heat dissipaters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.