Polishing pad cleaning with vacuum apparatus
US9498866B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Mar 5, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/003
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In one embodiment, a method for cleaning a surface of a polishing pad includes conditioning the polishing pad surface and rotating the conditioned polishing pad surface. The method also includes spraying the polishing pad surface to lift debris from the conditioned polishing pad surface. The method further includes vacuuming the debris from the polishing pad surface downstream from where the condition occurs, wherein downstream is defined by a rotational direction of the polishing pad. In another embodiment, a processing station including a rotatable platen, a substrate carrier head, a polishing fluid delivery system, a conditioner, a spray nozzle, and a vacuum system is provided. The conditioner is disposed between the substrate carrier head and the spray nozzle. The vacuum system is configured to vacuum the polishing pad surface. The vacuum system is downstream from the conditioner, defined by a rotation of the platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.