Microelectromechanical system device having a hinge layer
US9500857B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Jan 15, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0118
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.