Polish apparatus, polish method, and method of manufacturing semiconductor device
US9502318B2 · kind B2 · utility
1Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2015 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Mar 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polish apparatus including a rotatable table configured to receive a polish pad having a polish surface; a polish head configured to hold a polish object and configured to be capable of placing the polish object in contact with the polish surface while holding the polish object; at least one contact portion being provided with a contact surface and configured to be capable of contacting the polish surface when the table is in rotation; and a measurement portion configured to measure a state of the contact surface of the contact portion being configured to contact the polish surface of the polish pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.