Printed circuit board and semiconductor package using the same
US9502341B2 · kind B2 · utility
1Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2015 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | May 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0588
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the inventive aspect include a printed circuit board and a semiconductor package using the same. The semiconductor package includes a substrate having one or more connection pads, semiconductor chips mounted on the substrate, an underfill layer filling a region between the semiconductor chips and the substrate, and solder bumps electrically connecting the connection pads and the semiconductor chips in the underfill layer. The substrate includes void preventing patterns protruding on a top surface of the substrate under the underfill layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.