Lid attach process and apparatus for fabrication of semiconductor packages
US9502373B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Nov 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive dispenser comprises a dispensing head. The dispensing head comprises an adhesive material applicator portion on a first level of the dispensing head. The adhesive material applicator portion corresponds to a periphery of a package. The dispensing head also comprises a thermal interface material (TIM) applicator portion on a second level of the dispensing head different from the first level. The TIM applicator portion corresponds to a die of the package. The dispensing head further comprises an adhesive material conduit configured to supply the adhesive material applicator portion with an adhesive material. The dispensing head additionally comprises a TIM conduit configured to supply the TIM applicator portion with a TIM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.