Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
US9504168B2 · kind B2 · utility
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17References
12Claims
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Key dates
| Filing date | Sep 30, 2011 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Jul 10, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.