Methods of forming sensor integrated packages and structures formed thereby
US9505607B2 · kind B2 · utility
4Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2015 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Mar 27, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0109
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.