Substrate treating apparatus and method
US9506695B2 · kind B2 · utility
13Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2014 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Mar 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate treating apparatus. The substrate treating apparatus includes a first unit, a second unit, a supply line connecting the first unit to the second unit to supply a supercritical fluid from the first unit to the second unit, a flow rate adjustment member disposed in the supply line, and a filter disposed in the supply line to remove foreign substances. The supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.