Micromechanical measuring element and method for producing a micromechanical measuring element

US9506831B2 · kind B2 · utility

Assignee

• EPCOS AG · DE

Inventors

• Michael Schiffer · Hanau, DE
• Andreas Peschka · Michendorf, DE
• Jörg Zapf · Munich, DE
• Karl Weidner · Birkenfeld, DE
• Harry Hedler · Germering, DE

Key dates

• Filing date: Mar 8, 2013
• Grant date: Nov 29, 2016
• Expiry date: May 21, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15151
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.