Apparatus and method for treating substrate
US9508541B2 · kind B2 · utility
2Cited by
0References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2014 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Jan 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate treatment apparatus. The substrate treatment apparatus includes a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed, a plasma treatment unit supplying plasma to treat a top surface of the wafer, and a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.