Wafer level overmold for three dimensional surfaces
US9508566B2 · kind B2 · utility
3Cited by
36References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2014 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Aug 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.