Inline measurement of molding material thickness using terahertz reflectance
US9508610B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2014 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Dec 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method including emitting a terahertz beam from a light source at a layer of molding material; detecting a reflectance of the beam; and determining a thickness of the layer of molding material. A system including a panel supporter operable to support a panel including a plurality of substrates arranged in a planar array; a light source operable to emit a terahertz beam at a panel on the panel supporter; a detector operable to detect a reflection of a terahertz beam emitted at a panel; and a processor operable to determine a thickness of a material on the panel based on a time delay for an emitted terahertz beam to be detected by the detector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.