Method for lower thermal budget multiple cures in semiconductor packaging
US9508616B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2012 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | May 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a multilayer structure comprises the steps of: depositing a first polymerizable layer on a substrate; applying microwave energy to the polymerizable layer while monitoring at least one property of the layer; and, ending the application of microwave energy when the monitored property indicates that the polymerizable layer has reached a desired degree of cure. The property monitored may be optical, e.g., Raman spectrum, or electrical, e.g., dielectric loss. This process control strategy lowers the overall thermal budget, and is especially suitable for curing polymer films on silicon. The method may be used repetitively to cure multiple layers of polymeric material when a thicker film is needed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.