Die-tracing in integrated circuit manufacturing and packaging
US9508653B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2013 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Jan 31, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes recording a wafer ID and a location ID of a device die in a database, and bonding the device die over a package substrate, wherein the device die and the package substrate are disposed in a package. A package ID is on the package. A mapping is established to link the wafer ID and the location ID of the device die to the package ID.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.