Method for insertion bonding and device thus obtained
US9508665B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 7, 2010 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Jul 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for insertion bonding and a device thus obtained are disclosed. In one aspect, the device includes a first substrate having a front main surface and at least one protrusion at the front main surface. The device includes a second substrate having a front main surface and at least one hole extending from the front main surface into the second substrate. The protrusion of the first substrate is inserted into the hole of the second substrate. The hole is formed in a shape wherein the width is reduced in the depth direction and wherein the width of at least a part of the hole is smaller than the width of the protrusion at the location of the metal portion thereof. The protrusion is deformed during insertion thereof in the hole to provide a bond between the part of the hole and the metal portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.