Packaging structures and methods with a metal pillar
US9508666B2 · kind B2 · utility
12Cited by
81References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2013 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Dec 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.