Laser machining system and method for machining three-dimensional objects from a plurality of directions
US9511448B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2015 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Aug 10, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/29
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser machining system for machining a work-piece includes a laser scanning head, external optical subsystems, and an image acquisition device. The external optical subsystems correspond to optical channels that include a first optical channel and a second optical channel. The laser scanning head controls an optical path so that a laser beam is directed and focused on the work-piece through the first optical channel and the second optical channel at different times. The first optical channel and the second optical channel correspond to respective specific portions of the work-piece to be machined by the laser beam. The image acquisition device is positioned to view the work-piece through the optical path. The image acquisition device acquires via the first optical channel one or more images of the work-piece to determine a displacement of the work-piece with reference to a best optical focus position of the second optical channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.