Polishing device for removing polishing byproducts
US9511475B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2014 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Dec 26, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for removing polishing byproducts and a polishing device are provided. The method includes mounting a positive electrode on the center of a polishing platen and a negative electrode on an edge of the polishing platen, applying a voltage between the positive electrode and the negative electrode after a polishing process for metal is finished, and rotating the polishing platen and rinsing a polishing pad with deionized water or a chemical cleaning solution to remove polishing byproducts that are formed in the polishing process. The combination of the centrifugal force and the electromotive force increases the removal rate of the polishing byproducts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.