Thin film capping
US9511999B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2012 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Dec 17, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for sealing cavities in micro-electronic/-mechanical system (MEMS) devices to provide a controlled atmosphere within the sealed cavity includes providing a semiconductor substrate on which a template is provided on a localized area of the substrate. The template defines the interior shape of the cavity. Holes are made so as to enable venting of the cavity to provide a desired atmosphere to enter into the cavity through the hole. Finally, a sealing material is provided in the hole to seal the cavity. The sealing can be made by compression and/or melting of the sealing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.