Projection exposure apparatus for microlithography for the production of semiconductor components
US9513562B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2014 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Dec 25, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70991
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A projection exposure apparatus for microlithography for the production of semiconductor components includes at least one optical assembly with at least one optical element which can be actuated in a mechanically controlled manner is mounted in a structure. For carrying out the mechanical actuation, a control signal transmission device and/or an energy transmission device are/is provided, which introduce(s) no parasitic mechanical effects into the optical assembly at least during specific operating states of the projection exposure apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.