Baffle and substrate treating apparatuses including the same
US9514919B2 · kind B2 · utility
3Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2012 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Jun 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32633
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate treating apparatus, which includes a plasma generating part configured to generate plasma, a housing disposed under the plasma generating part, and having a space therein, a susceptor disposed within the housing and supporting a substrate, and a baffle including injection holes injecting the plasma supplied from the plasma generating part, to the substrate. The baffle includes a base in which the injection holes are formed, and a central portion of the base is thicker than an edge thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.