Patent · US Active

Flexibly-wrapped integrated circuit die

US9515049B2 · kind B2 · utility

0Cited by

2References

7Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Sven Albers · Regensburg, DE
Michael P. Skinner · San Jose, US
Hans-Joachim Barth · Munich, DE
Peter Baumgartner · Munich, DE
Harald Gossner · Riemerling, DE

Key dates

Filing date	Dec 19, 2013
Grant date	Dec 6, 2016
Priority date	—
Expiry date	Dec 19, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19104
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.