Semiconductor device and stacked semiconductor package having the same
US9515054B2 · kind B2 · utility
2Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2012 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Aug 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a plurality of semiconductor chips connected through a scribe lane; a plurality of through electrodes formed in each of the plurality of semiconductor chips; a heat dissipation member formed in the scribe lane; and heat transfer members connecting the through electrodes with the heat dissipation member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.