Ultrasound assisted immersion cooling
US9516792B2 · kind B2 · utility
21Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2015 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Mar 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2079
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.