Method for microwave processing of photosensitive polyimides
US9519221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2015 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Jan 12, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for curing photosensitive polyimide (PSPI) films includes the steps of: depositing a PSPI film on a selected substrate, and curing the film by microwave heating at a selected temperature from about 200 to 340° C. in a selected atmosphere containing an oxygen concentration from about 20 to 200,000 ppm. The process atmosphere may be static or flowing. The addition of oxygen improves the removal of acrylate residue and improves the Tg of the cured film, while the low processing temperature characteristic of the microwave process prevents the oxygen from damaging the polyimide backbone. The method may further include the steps of photopatterning and developing the PSPI film prior to curing. The process is particularly suitable for dielectric films on silicon for electronic applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.