Method and apparatus for clamping and cooling a substrate for ion implantation
US9520264B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2012 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | May 25, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49998
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system and method are disclosed for holding and cooling substrates during processing. A substrate clamp has an engagement portion for engaging a substrate about the inside diameter as well as a portion of the substrate surface immediately adjacent to the inside diameter. The clamp has a retracted position which enables the engagement portion to fit through the substrate ID, and an expanded position which enables the engagement portion to engage the substrate ID and the substrate surface immediately adjacent to the inside diameter. The clamp can include a conformal coating to enhance engagement between the substrate and the engagement portion. The clamp can also include an energy absorbing coating on one or more surfaces to maximize the absorption of radiative energy emitted from the substrate. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.