Patent · US Active

Power management applications of interconnect substrates

US9520342B2 · kind B2 · utility

4Cited by
12References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 29, 2015
Grant dateDec 13, 2016
Priority date
Expiry dateAug 8, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/381
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Various applications of interconnect substrates in power management systems are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.