Method of manufacturing thermal flow meter
US9523595B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2014 |
| Grant date | Dec 20, 2016 |
| Priority date | — |
| Expiry date | Feb 7, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F5/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An objective of the present invention is, in a thermal flow meter having a structure including a resin portion formed in the vicinity of a diaphragm structural portion using a mold, to prevent destruction of the diaphragm structural portion at the time of pressing the mold, in a method of manufacturing the thermal flow meter, including: supporting a gas flow measurement element 200 on support members 102b and 111, the gas flow measurement element 200 including a cavity portion 202 surrounded by a substrate inclined portion 202a inclined to a substrate surface, a diaphragm 201 that covers the cavity portion, and an electrical resistive element formed in the diaphragm 201; and covering the gas flow measurement element 200 and the support members 102b and 111 with the resin portion 104 formed with the mold, to set the mold 14 such that an acting portion of pressure force by the mold that molds the resin portion 104 is positioned outside the substrate inclined portion 202a in the entire periphery of the diaphragm 201.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.