Interconnects including liquid metal
US9523713B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2013 |
| Grant date | Dec 20, 2016 |
| Priority date | — |
| Expiry date | May 23, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the present disclosure are directed to interconnects that include liquid metal, and associated techniques and configurations. The individual interconnects may electrically couple a contact of a printed circuit board (PCB) to a contact of a device under test (DUT). The interconnect may be disposed in or on the PCB. In various embodiments, the interconnect may include a carrier that defines a well (e.g., an opening in the carrier), and the liquid metal may be disposed in the well. In some embodiments, the contact of the DUT, or a contact of an intermediary device, may extend into the well and directly contact the liquid metal. In other embodiments, a flex circuit may be disposed over the well to seal the well. The flex circuit may include a conductive pad to electrically couple the liquid metal to the contact of the DUT. Other embodiments may be described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.