Substrate transfer antechamber mechanism

US9524895B2 · kind B2 · utility

Assignee

• National Institute of Advanced Industrial Science and Technology · JP

Inventors

• Shiro Hara · Ushiku, JP
• Hitoshi Maekawa · Yokohama, JP

Key dates

• Filing date: Oct 29, 2013
• Grant date: Dec 20, 2016
• Expiry date: Oct 29, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67778
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

There is provided a substrate transfer antechamber mechanism for a compact manufacturing apparatus that produces various types of devices in small volume using a small-diameter processing substrate at low cost. A container placement table, on which a wafer transfer container housing a semiconductor wafer is placed, is provided on an upper surface of an apparatus antechamber for a compact semiconductor manufacturing apparatus, and the apparatus antechamber includes therein a wafer elevating mechanism and a horizontal transfer mechanism. The wafer elevating mechanism moves down while holding from below a delivery bottom of the wafer transfer container, on which the semiconductor wafer remains placed, to transfer the semiconductor wafer into the apparatus antechamber. The horizontal transfer mechanism transfers the semiconductor wafer into a processing chamber using a transfer arm that receives the semiconductor wafer from the delivery bottom and extends.