Packaged device with additive substrate surface modification

US9524926B2 · kind B2 · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• Benjamin Stassen Cook · Addison, US
• Juan Alejandro Herbsommer · Allen, US
• Yong Lin · Troy, US
• Rongwei Zhang · Dallas, US
• Abram Castro · Fort Worth, US
• Matthew David Romig · Richardson, US

Key dates

• Filing date: Sep 9, 2015
• Grant date: Dec 20, 2016
• Expiry date: Sep 9, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.