Patent · US Active

Back-to-back stacked dies

US9524957B2 · kind B2 · utility

10Cited by

12References

11Claims

0Family size

Assignee

Intersil Americas LLC · US

Inventors

Francois Hebert · San Mateo, US
Steven R. Rivet · Malabar, US
Michael Althar · Melbourne, US
Peter Oaklander · Saratoga, US

Key dates

Filing date	Jan 26, 2012
Grant date	Dec 20, 2016
Priority date	—
Expiry date	Sep 30, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49121
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.