Movement microelectromechanical systems (MEMS) package
US9527721B2 · kind B2 · utility
11Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2015 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | May 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.