Patent · US Active

Packages for semiconductor devices and methods for assembling same

US9527727B2 · kind B2 · utility

0Cited by
1References
21Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 26, 2014
Grant dateDec 27, 2016
Priority date—
Expiry dateSep 26, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/181
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

One or more embodiments of the present disclosure are directed to packages that include a stacked microelectromechanical sensor MEMS die and an application-specific integrated circuit (ASIC) die. The smaller of the MEMS die and the ASIC die is stacked on the larger of the MEMS die and the ASIC die. The larger of the two dice may form one or more dimensions of the package. In one embodiment, a bottom surface of the larger of the two dice forms an outer surface of the package. In that regard, the package may take less lateral space on another component, such as a board or other package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.