Method for processing a substrate and apparatus for performing the same
US9529267B2 · kind B2 · utility
5Cited by
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15Claims
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Key dates
| Filing date | Jun 27, 2013 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Feb 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for processing a substrate includes arranging the substrate on which a photoresist layer is formed and providing a treatment liquid for removing the photoresist layer on the substrate. The method also includes providing a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid. Therefore, efficiency of removing the photoresist layer may be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.