Flexible electronic circuit and method for manufacturing same

US9530708B1 · kind B1 · utility

Assignee

• HRL Laboratories, LLC · US

Inventors

• Hasan Sharifi · Craydon Court, US
• Keisuke Shinohara · Thousand Oaks, US
• Mary C. Montes · Calabasas, US
• Charles McGuire · Newbury Park, US
• Wonill Ha · Thousand Oaks, US
• Jason May · Santa Monica, US
• Hooman Kazemi · Waltham, US
• Jongchan Kang · Moorpark, US
• Robert G. Nagele · Turnersville, US

Key dates

• Filing date: May 31, 2013
• Grant date: Dec 27, 2016
• Expiry date: Aug 9, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic circuit comprising: an integrated circuit chip, the integrated circuit chip having a top face; portions of the top face of the chip being covered by a first metal layer electrically connected to the integrated circuit; and a dielectic layer formed on the top face of the chip beside and on top of said first metal layer; wherein the dielectric layer extends parallel to the top face of the chip beyond the edges of the chip, the first metal layer extending in the dielectric layer beyond the edges of the chip; and wherein portions of a top surface of the dielectric layer are covered by a second metal layer, portions of the first and second metal layers being electrically connected through the dielectric layer.