Semiconductor device and method of fabricating the same
US9530726B2 · kind B2 · utility
2Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2013 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Mar 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a via structure having a top surface with a planar portion and a protrusion portion that is surrounded by the planar portion, and includes a conductive structure including a plurality of conductive lines contacting at least a part of the top surface of the via structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.