Integrated circuit device
US9530945B2 · kind B2 · utility
2Cited by
148References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 25, 2013 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Nov 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrally packaged optronic integrated circuit device including an integrated circuit die containing at least one of a radiation emitter and radiation receiver and having a transparent packaging layer overlying a surface of the die, the transparent packaging layer having an opaque coating adjacent to edges of the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.