Method of fabricating a printed circuit board interconnect assembly
US9532465B2 · kind B2 · utility
0Cited by
12References
1Claims
0Family size
Inventors
Key dates
| Filing date | Mar 28, 2013 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Jun 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a method of fabricating an interconnect comprising aligning and stacking a plurality of printed circuit boards with at least one adhesive component, laminating the printed circuit boards and the adhesive component, preparing bonded pair holes, depositing a copper seed layer, forming a copper plate image, electroplating a copper layer, removing a plate resist and depositing an insulator layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.