John Vesce, III
2Patents
0h-index
1Co-inventors
24Inventor score
Filing activity: Mar 28, 2013 → Aug 28, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9532465B2 | Method of fabricating a printed circuit board interconnect assembly | Emerging Cross-Sectional Technologies | 0 | Active |
| US11277909B2 | Three-dimensional circuit assembly with composite bonded encapsulation | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.