Circuit substrate
US9532467B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 6, 2013 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Oct 15, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit substrate includes a base layer, a first patterned conductive layer, a dielectric layer, a conductive block and a second patterned conductive layer. The first patterned conductive layer is disposed on the base layer and has a first pad. The dielectric layer is disposed on the base layer and covers the first patterned conductive layer, wherein the dielectric layer has an opening and the first pad is exposed by the opening. The conductive block is disposed in the opening and covers the first pad. The second patterned conductive layer is disposed on a surface of the dielectric layer and has a second pad, wherein the second pad and the conductive block are integrally formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.