Patent · US Active

Chip card substrate and method of forming a chip card substrate

US9533473B2 · kind B2 · utility

0Cited by

1References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Siegfried Hoffner · Nesselwang, DE
Mohammed Reza HUSSEIN · Regensburg, DE
Frank Pueschner · Kelheim, DE
Thomas Spoettl · Mintraching, DE

Key dates

Filing date	Apr 3, 2014
Grant date	Jan 3, 2017
Priority date	—
Expiry date	Apr 18, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24998
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A chip card substrate is provided that includes a first polymer layer including a first polymer material. The chip card substrate further includes an intermediate layer disposed over the first polymer layer and including polyolefin including a plurality of micro pores, an adhesive layer disposed over the intermediate layer and including an adhesive, and a second polymer layer disposed over the adhesive layer and including a second polymer material different from the first polymer material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.