Patent · US Active

Low stress compact device packages

US9533878B2 · kind B2 · utility

0Cited by

26References

20Claims

0Family size

Assignee

Analog Devices, Inc. · US

Inventors

Thomas M. Goida · Windham, US
Kathleen O'Donnell · Arlington, US
Michael D. Delaus · Andover, US

Key dates

Filing date	Dec 11, 2014
Grant date	Jan 3, 2017
Priority date	—
Expiry date	Dec 11, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various low stress compact device packages are disclosed herein. An integrated device package can include a first integrated device die and a second integrated device die. An interposer can be disposed between the first integrated device die and the second integrated device die such that the first integrated device die is mounted to and electrically coupled to a first side of the interposer and the second integrated device die is mounted to and electrically coupled to a second side of the interposer. The first side can be opposite the second side. The interposer can comprise a hole through at least the second side of the interposer. A portion of the second integrated device die can extend into the hole.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.